| 护坡砖模具超精密加工在进一步发展 |
| 添加时间：2019/1/19 13:36:44 浏览次数： |
| 随着模具产业的不断发展,一些原先存在的问题也不断的显现出来,也越发的严重起来。出现了护坡砖模具低成本,产品结构档次和技术含量不高,粗糙等问题的出现,而这些企业绝大多数是劳动力密集的小型企业。这一类的企业所生产的模具数量多,价格低,利润低,没有技术含量,不具备竞争优势,很容易倒闭。 With the continuous development of the die and mould industry, some of the original problems are constantly emerging, and become more and more serious. The problems such as low cost of slope protection brick mould, low level of product structure and technology, rough and so on appeared, and the vast majority of these enterprises are labor-intensive small enterprises. This kind of enterprise produces a large number of moulds with low price, low profit, no technical content, no competitive advantage and easy to close down. 我国护坡砖模具行业日趋大型化,模具大型化、数字化及生态节能化一直是重要发展趋势,是由于高生产效率要求而决定的。为了提高生产效率而发展起来的一模多腔技术正在等到越来越广泛的应用。很显然,同样的一次注塑过程可以同时制造多个产品,生产效率自然翻番了。零部件也日趋大型化了,也这直接导致了护坡砖模具必须大型化。高强度板和不等厚激光焊接板的冲压成形技术应用已越来越普遍,高强度钢板热冲压成形和大型铝合金板冲压成形技术在汽车生产中的应用也日益增多。由于高速冲床的运行速度越来越高,集成电路脚距越来越细密,接插件精度越来越高且体积越来越小,因此超精密加工在进一步发展。 The moulding industry of slope protection bricks in China is becoming larger and larger. The large-scale, digitalization and eco-energy saving of moulds have always been an important development trend, which is determined by the requirement of high production efficiency. The multi cavity technology developed in order to improve production efficiency is waiting for more and more extensive applications. Obviously, the same injection process can produce multiple products at the same time, and the production efficiency will doubled naturally. Components are becoming larger and larger, which directly leads to the large-scale moulds of slope protection bricks. The stamping technology of high strength sheet and laser welded sheet with different thickness has become more and more popular. The hot stamping technology of high strength sheet metal and the stamping technology of large aluminium alloy sheet are also increasingly applied in automobile production. As the running speed of high-speed punch is higher and higher, the foot pitch of integrated circuit is more and more compact, the precision of connector is higher and higher, and the volume is smaller and smaller, so the ultra-precision machining is further developed. |
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